The primary purpose of the device
Silicon solar cell scribing (or cutting, slicing ). Can be of different specifications and different brands of monocrystalline silicon and polycrystalline silicon battery tablets dicing process.
Technical parameters
Laser wavelength: 1064 nm
The laser average power : 50W
Laser repetition frequency : 200Hz ~ 50kHz ( adjustable )
Scribing the minimum line width : 50 m
Maximum cutting speed: 120mm / S
Maximum section thickness: 1.2mm
Workbench: Web 350 x 350mm / stroke 320 x 320mm
Working mode : Double warehouse vacuum adsorption, T type double station to work alternately.
Cooling system: circulating water ( purified water) / inverter compressor refrigeration
The use of power: 380V / 50Hz / 5kVA
Performance characteristics
A laser
1, the core components ( cavity ) uses the import of new materials, greatly improve the photoelectric conversion efficiency.
In 2, replacing the first generation of gold-plated metal cavity, avoiding the removal of gold, more durable.
3, good beam quality. Quasi fundamental mode (low order mode ), with small divergence angle.
4, full closed optical path design, to ensure that the laser long-term continuous stable operation, stronger adaptability to environment.
5, with Lu Hongguang at the position.
Two, equipment superior performance
In 1, patented technology to ensure that the equipment more stable performance, higher efficiency.
2, low current, high efficiency. Small operating current (less than 11A), speed ( 140mm / s ) to extend the krypton lamp service life, reduce maintenance, reduce the material loss, reduce the failure rate, reduce the cost of the operation.
In 3, long continuous working time. Work 24 hours a day.
In 4, stable operation. Scribing of high rate of finished products.
In 5, the machine adopt international standard modular design, reasonable structure, convenient installation and maintenance simple.