Taijin Semiconductor is a manufacturer, molding range of automatic and manual molding systems have a proven reputation for innovation, quality, reliability and high volume output. Based on experience, each system has been designed to meet the challenges of today’s ever more demanding manufacturing processes. Driving forces as cost, performance and form factor are punching molding into a new type of packages and interconnections such as DP, SOP, QFP, DFN, QFN, SIP, with carriers as BGA and QFN. For all these new specific applications Taijin offers the best solution and equipment for your requirements.