Features:
1,Saving material

Cutting crack is small and piece rate is high, saving material greatly.
2,Cutting precision

Cutting accuracy can be achieved, and surface is smooth, it can be polished directly after cutting, saving the grinding, time and material.
3,Cutting speed

Diamond cutting wire cutting speed is faster, greatly improving the work efficiency.
4,No edge breakage.

While cutting a variety of hard and brittle material, edge breakage are less than 10mm.

5,Reduce environmental pollution

Cutting and cooling by water, can prevent powder pollution and maintain environment of materials and equipment clean.


Applications:

1. PV WAFERING
The use of Diamond Wire for cutting mono- / multi-silicon wafers is a technology leap offering significant performance and cost saving benefits over traditional cutting methods. We are dedicated to achieving the highest yield with the lowest total cost of ownership for our clients. To attain this goal, we engage in a holistic approach to cutting that ensures the total cost of ownership enablers are aligned and integrated and result in a stable process.

2.Sliicon Cutting
Bricking, Cropping, Filament Cutting and Semiconductor applications will realize many key benefits when using our diamond wire cutting technology and related products.

Most notably:

Lower cost of ownership
Increased productivity
Precision cuts

3.Sapphire Wafering

diamond wire cutting technology, and related products, will optimize your sapphire cutting processes and deliver outstanding results.

Key benefits:

Fast cut times
Reduced cost of ownership
Reduced subsurface damage
Improved bow values
Excellent Ra values
Superior warp values