As the third generation heat sink material, the main characteristics of ALSIC: Controlled thermal expansion coefficient, high thermal conductivity, high stiffness, high wear resistance, low thermal expansion, low density, many disadvantages of conventional materials on it is naturally overcome to meet cooling requirements of high-end high-power electronics. As new materials, the problem ALSIC material on the market is facing is obvious, they are substitutes, new competitors and attempt to occupy the main position of leader. ALSIC has about one billion Yuan market, the potential market is about tens of billions of Yuan, the main market is the power electronics market, namely IGBT and LED markets.