XG TECHNOLOGIES CO., LTD

1. Semiconductor Field 2. IT Field (Telecommunication System Board) 3. Auto Mobile Board Field/High Current Distribution 4. High Current Power Supply Board 5. LED PKG 6. Medical Equipment Board Our PCB technology includes 1. HPL technique (Hole Plugging Land): Via on PAD technique, forming via hole under SMD pad 2. TGFR: Track Gap Filled Resin 3. Multi-copper thickness PCB 4. Metal Core PCB Structure 5. Special Metal Core PCB: This new technique can radiate heat effectively from product and apply for LED package reflector 6. Special LED PKG PCB: New technique for radiating heat 7. Ceramic PCB Metalizing Technique: 8. Embedded resistor PCB 9. Radiation Solder Mask 10. High Reflection Resin PCB 11. High Young&＃039;s Modulus Resin: Prevents PCB board crack by it&＃039;s high elasticity at the lead free soldering. 12. Multi Cavity PCB: Minimizes the PCB thickness & chip mounted PCB can be multi stack-up. 13. Multi Resin Board PCB