Building on our experience in the semiconductor industry, Runde has developed the line of adhesives, ingot support beams and guide wheels to accommodate the unique challenges of the wafering process. The rapidly changing technology of wafering requires continual development to meet these challenges. Our product development efforts have led to unique products including water resistant adhesive systems for wafering, simple heat release adhesives for monocrystalline ingot squaring, support beam technology compatible with fixed abrasive wire slicing. We continue to work closely with our customers to understand and meet their continually changing needs in this dynamic industry.