��esoldering��Take off the through-hole component from the board when do repair is quite difficult. If you do not take care of the take off process, it is very easy to damage the through-hole soldering pan and the conductive through-hole wall. S300 is designed for this application, helping take off the through-hole component safety and easy especially to the multi-lead-pin component and heavy thermal capacity component.Put the board on the board holder, select the right solder nuzzle, alight it to the target component pin, starting the solder pump, the solder will raise to the through-hole lead pin. In one wave programmed, the component is desoldered in couple of seconds. Then, you can take off it safety and easily. After that, you can use the air nuzzle press the board from above and blow off the solder dross leaving the through-hole in neatness. 2. SpecificationApplication 竊�all through-hole component as IC, transform, connector, and so onSoldering process 竊�lead or lead freePCB max. 竊�600 x 500 mmComponent length 竊�max. 220 mmSoldering peak height 竊�0 to 10 mm above nuzzle, programmable Solder pump 竊�propeller driven by servo motorLead free pump 竊� made by titanium竊�ptional竊�Control unit 竊�PLC of Siemens竊�CD display of the parameter竊�mall key board as operate panel竊�oot switchSoldering peak high 竊�programmable controlled by PLCSoldering wave up speed : programmableSoldering wave down speed : programmableSoldering time : programmable Soldering temperature 竊�PID close loop control by PLC Max. 380 Celsius Soldering process 竊�Two modules, manual control or automatic program control One solder process can be divided into different section of soldering with different height and last time.Can be programmed one wave soldering and two times soldering like double wave soldering. Standard nuzzle 竊�竊�ptional竊�Special nuzzle 竊�customer request design竊�ptional竊�ome nuzzle can be used t