Adhesive for chip mounting machines SND series(红胶) We developed “SND series ”adhesive for chip mounting machines or SMD.They are one-part thermo-setting epoxy adhesive with the property of preservation stability, and are of 1 to 2 minute short time or high speed curability required for 120 to 150℃ heat-give SMD packaging.We are ready, in addition, to offer the adhesive of various grades with excellent micro-printability or with suitability for high-speed dispensers. Packaging:200gr、360gr, 10cc, 20cc, 30ccsyringes, 1000g is standard bottled Underfill Halogen-free High-Lead(Pb) Die-Attach Solder Paste（高铅锡膏） High lead, high melting point alloys, lead content is more than 85%. Can meet the RoHS directive. Usually used in package of power semiconductor device, can Miscibility with Au, Cu, AG, high residual impedance and good welding strength. The halogen-related failure mode for die-attach solder pastes is the corrosion of wirebond pads on the topside of Power Semiconductor die which are soldered to the leadframe with halogen-containing solder paste. Packaging: 35g is 10CC syringes, 100g is 30CC syringes, 500g is standard bottled, 1000g is bottled or syringes