Shenzhen Goldlink Tongda Electronics Co., Ltd

Business Type Manufacturer
Location Room616-619 Huafengxin'an building 45dist. bao'an Shenzhen, Guangdong
Year Established 1997
Main Markets Europe, North America, South America, Australia
Main Products Thermal Conductive Heat Transfer,
Country/Region China
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Company Introduction

Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority. Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.ProductsOur business includes Silicone Thermal Pad, Silicone Rubber Pad, Silicone Putty Pad, Silicone Thermal Tape, Thermal Interface Grease, Two-part Thermal Interface Sealing Compound, Silicone Thermal Gel, Thermal Interface Phase Change Materials and Non-Silicone type products. ApplicationsWe serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.

Contact Information

Contact Person Lynn Gui
Job Title Business Manager
Telephone 86 - 0755 - 27579310
Address Room616-619 Huafengxin'an building 45dist. bao'an Shenzhen, Guangdong
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