Business Type Manufacturing
Year Established 2001
Main Markets Worldwide
Main Products Die Bonder,Die Attach,Semicondutor Assembly, Electronics Package,Ics And Transistor Package,
Country/Region China
Company Introduction
Dalian Jafeng electronics co., ltd, focusing on the R&D, manufacture with sale of semiconductor back-end package equipment, is one professional manufacturer of die bonders which are used for the Transistor, ICsã€LEDã€Crystal Oscillator, IC card etc package. It sells well due to its high quality, competitive price, and so we win the most of the VIP by its advance technology, high reliability and excellent working team in short time. Our products are: *Soft Solder Die Bonders---for Transistor Package: TO-126 TO-220 TO-23 TO-3P etc; *Epoxy Die Bonder---for IC LED DIP SOP SIP TSOP QFP LQFP PLCC SSOP BGA IC Card Crystal Oscillator etc package; *COG Bonder--- For LCD package; *RFID Flip Chip Bonder---For Flip Chip package; sheilawu2009at *****
Contact Information
Contact Person Ms. sheila wu
Department Manager
Telephone 86-411-13591767842
Fax Number 86-411-84791210
Address high-tech zone, dalian, liaoning, China
Fax 86-411-84791210
Zip/Post Code 116025
Website Visit website