Compound Semiconductor Manufacturing (Xiamen) Co.,Ltd is an advanced semiconductor manufacturing technology based joint venture company invested from the Korea, China and Singapore, registered in the city of Xiamen, China. We have equipped with advanced semiconductor manufacturing tools including MPCVD, MOCVD, LPCVD, HVPE and high temperature PVD to produce high quality Diamond wafer and AlN template on various substrate including Si, sapphire, and polished diamond. Our mission is to be the most advanced compound semiconductor company in the global market, contributing to the related technology development. We have strong R&D team and actively collaborate with best research group around the world. Currently, we are providing the thermal grade diamond, which can be used as an effective heat sink aims to solve the heat issue in temperature sensitive device, such as power devices, lasers and avalanche photodiodes etc. We also provides wafer scale polished diamond with sub-nanometer RMS surface roughness, which might be suitable for the integration of GaN, GaO and AlN epilayers and devices on Diamond via direct bonding or heteoepitaxy.