Copper-aluminum clad plate is metallurgical bonding material with 100% bonding, high tensile strength, yield strength, shear strength and elongation, which is very good conductor material. Copper-aluminum clad plate not only have prefect electrical conductivity of Cu and low density, good weldability of Al but also keep there individual property. Copper is a metal with excellent corrosion-resistant, oxidation resistance, high heat capacity, Aluminum is a metal with high temperature conductivity, low cost and good appearance as copper. This is a new kind of energy saving materials. Currently the price of non-ferrous and energy is rising sharply, choose the Copper-aluminum clad material is a sensible way