Acrosemi Corporation draws upon 40 years of experience to offer a broad range of the world&＃39;s leading innovative products and turn-key solutions used in the development and production of microelectronic devices for the semiconductor, photonics, hybrid, microlithography, surface mount techonology (SMT) and printed circuit industries and also for soldering, brazing and glass sealing of microelectronic packages and components. A complete line of Manual Wire and Die Bonding, Semi-Automatic, and Automatic Wire Bonding Machines is also available. They are modularly designed for maximum process flexibility, yet are simply designed for reliable, continuous operation. We specialize in providing sales selection advice and trial, and after-sale installation, support and service for all of our equipment. In addition, we can also assist in Turnkey Solutions for: * Surface Mount Assembly and Test Production Line. * Microwave, Hybrid Assembly, and Test Production Line. * Nanotech, MEMS Assembly, and Test Production Line. * Photonics, IC, RF Assembly, and Test Production Line. * Thick / Thin Film Assembly Line. * MEMS Package Sealing Line. * Hermetic Package Sealing Line. * Full range of Microelectronics Test, Assembly, and Packaging Line.