MIS Co., Ltd is proud to introduce its &＃39;MIS Auto Decaper&＃39; machine.MIS Auto Decaper machine removes automatically EMC(Epoxy Molding Compound) or plastic molding of any packaged semiconductor chip without melting solder bumps, over etching on metal bond pads, wire lifting, or destroying external leads using mechanical milling method and chemical etching method.- Full automatic decapsulation- No need of Gasket- Easy operation using GUI- Safe and speedy process- Variety to the many kinds of package type - More economic useWe have already supplied our &＃39;Decaper Machine&＃39; to &＃39;Samsung Electronics&＃39;, &＃39;LG Electronics&＃39; and &＃39;Amkor Technology Korea&＃39;. Last year, we have finished new developments of new machine including updated functions required by them. Thank you for your interest in our product. If you have more questions, please feel free to contact us.Best regards,Gabriela JangMarketing Assistant ManagerTel. : 82-31-459-8088, 7088Fax. : 82-31-459-6088