When Amkor Technology was founded in 1968, many of the products that we take for granted today existed only in the mind's eye of visionaries.

Amkor helped make these visions a reality by pioneering the outsourcing of semiconductor assembly and test services. Today, Amkor is a strategic contract manufacturing resource for many of the world's leading semiconductor companies. We have developed unique expertise in high-volume manufacturing techniques and have diversified and expanded our operational scope by establishing production centers in strategic locations throughout Asia.

Amkor provides leading-edge package solutions such as Stacked Packaging, Flip Chip, MicroLeadFrame, System-in-Package, Image Sensors, MEMS, and MMC / SD for latest generation applications.

Amkor supplements its world-class operational scope with the industry's
- Largest package design staff
- Broadest portfolio of packaging technology
- Deepest sales and support organization

As integrated circuits increase in speed and complexity, the right semiconductor packaging becomes critical to ensure optimal system performance. Amkor is an industry leader in tailoring application-specific package design, assembly and test solutions.

Amkor offers the industry's broadest array of package formats and sizes, from traditional, "off-the-shelf" leadframe configurations to leading-edge chip scale, flip chip and system-in-package solutions incorporating highly customized designs. This allows Amkor to be a single source for many of our customers' total IC packaging requirements.

We also provide a complete range of test engineering services for RF, mixed signal, logic and memory devices, from test program development to full product characterization. Amkor is a major provider of RF test services and is the world leader in Strip Test, an innovative, highly parallel test solution that offers customers low cost, faster index time and improved test yields.